Multicore DA101
Flux designed for solder die attach paste applications. Effective thermal control for Cu leadframe power semiconductor devices, such as rectifiers, power transistors, and for automorive and consumer packages.
Multicore DA101
Flux designed for solder die attach paste applications. Effective thermal control for Cu leadframe power semiconductor devices, such as rectifiers, power transistors, and for automorive and consumer packages.
Achieving-thermal-control-for-power-devices-die-attach-solder-pastes-for-varying-requirements.pdf
Henkel-extends-die-attach-solder-paste-product-line-adds-printable-formula-to-popular-portfolio.pdf
Multicore DA101
Flux designed for solder die attach paste applications. Effective thermal control for Cu leadframe power semiconductor devices, such as rectifiers, power transistors, and for automorive and consumer packages.
